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Adhesive stencil printing

SMT-components which have to be soldered by wave soldering process before soldering have to be glued to the printed circuit board.

Component Failure

A bond wire has been evaporated by electrical overstress. Only visible by x-ray inspection!

Conterfeit components

Components that have been bought from brokers after agreement of customers have to be carefully and in an extended procedure inspected at incoming goods inspection.

Hidden solder joints

Even with hidden solder joints on conventional leaded components it is required to x-ray for process qualification and testing.

Fiducials

Fiducials according to SMEMA-standard have to be provided on all printed circuit boards, which have to be processed automated.

Wetting failure on NiAu-Metallization

Wetting failures on NiAu-surfaces may have different root causes.

Glued Printed Circuit Board

Printed circuit board with stencil printed SMT adhesive in conveyor system of the pick and place machine.

Stencil printing

Paste printing is one of the most important factors for quality of solder joints and thus for the reliabiltiy of electronic assemblies.

JET-Printing or JET-Dispensing

JET-Printing or JET-Dispensing is a relatively new alternative methode for the application of solder paste.

Limited Reliability of Solder Joint with Vias in Pads

Vias in pads are a big reliability risk for solder joints, if components are reflow soldered.

X-Ray Image of Tantalum Capacitor

Wrong color images often improve the possibility to interpret difficult x-ray images.