SMT-components which have to be soldered by wave soldering process before soldering have to be glued to the printed circuit board.
A bond wire has been evaporated by electrical overstress. Only visible by x-ray inspection!
Components that have been bought from brokers after agreement of customers have to be carefully and in an extended procedure inspected at incoming goods inspection.
Even with hidden solder joints on conventional leaded components it is required to x-ray for process qualification and testing.
Fiducials according to SMEMA-standard have to be provided on all printed circuit boards, which have to be processed automated.
Wetting failures on NiAu-surfaces may have different root causes.
Printed circuit board with stencil printed SMT adhesive in conveyor system of the pick and place machine.
Paste printing is one of the most important factors for quality of solder joints and thus for the reliabiltiy of electronic assemblies.
JET-Printing or JET-Dispensing is a relatively new alternative methode for the application of solder paste.
Vias in pads are a big reliability risk for solder joints, if components are reflow soldered.
Wrong color images often improve the possibility to interpret difficult x-ray images.