With the 3D AOI Zenith from KohYoung we can automatically inspect assemblies. The camera head has 8 special strip projectors, which enable extensive shadow-free measurement of components. Soldering joints are also measured in 3D or evaluated in 2D using RGB ring lighting.
Further test options are polarity, offset, text recognition, color coding and foreign material. The test parameters can be set according to IPC-A-610, among others. Gerber and assembly data are required for the creation of test programs.
- XY = 10 µm
- Z = 1 µm
Printed circuit boards with the following dimensions can be inspected:
- max: 510 mm x 510 mm
- min: 50 mm x 50 mm
- Thickness: 0.4mm – 5.0mm
- Component clearance above and below: 50 mm