Apr 25, 2016 | Uncategorized
Wrong color images often improve the possibility to interpret difficult x-ray images.
Apr 25, 2016 | Uncategorized
Vias in pads are a big reliability risk for solder joints, if components are reflow soldered. Often the solder is sucked from the pad through the via, causing a solder joint with less solder which becomes unreliable under thermal stress. Therefore vias in pads should...
