X-Ray Image of Tantalum Capacitor

TAUBE ELECTRONIC has been successfully using two new JUKI RS-1R placement machines in production since November 2020. After dismantling the old machines and installing...

This year, the ISO 9001:2015 audit took place under special conditions. Due to the current pandemic situation, the entire recertification audit had to be carried out...

In the course of tighter and tighter layouts, this project was intended to test the limits of what is currently feasible with regard to different component sizes in one...

Last December Dr. Lothar Weitzel joined TAUBE ELECTRONIC GmbH as Managing Director. The company was already well-known to him, as he had previously worked with Rainer...

TAUBE ELECTRONIC successfully enters 300µm pitch component class TAUBE ELECTRONIC since many years is one of the pioneers in processing components with very fine pitch....

TAUBE ELECTRONIC starts to operate new Fischerscope X-Ray XDV-SSD Since the implementation of leadfree RoHS compliant assembly processes Micro X-ray fluorescence...

Printed circuit board with stencil printed SMT adhesive in conveyor system of the pick and place machine.

Wetting failures on NiAu-surfaces may have different root causes.

Fiducials according to SMEMA-standard have to be provided on all printed circuit boards, which have to be processed automated. The current revision of SMEMA-standard of...

Even with hidden solder joints on conventional leaded components it is required to x-ray for process qualification and testing. By analysys of PCBAs, which were...

Components that have been bought from brokers after agreement of customers have to be carefully and in an extended procedure inspected at incoming goods inspection.

A bond wire has been evaporated by electrical overstress. Only visible by x-ray inspection!

SMT-components which have to be soldered by wave soldering process before soldering have to be glued to the printed circuit board. The most economical technique is...

For process qualification and inspection of covered solder joints high resolution x-ray inspection is an indispensable condition.

JET-Printing or JET-Dispensing is a relatively new alternative methode for the application of solder paste. Advantages Stencil free paste printing Flexible application...

Paste printing is one of the most important factors for quality of solder joints and thus for the reliabiltiy of electronic assemblies. In the stencil printing process...

Vias in pads are a big reliability risk for solder joints, if components are reflow soldered. Often the solder is sucked from the pad through the via, causing a solder...