Apr 28, 2016 | Uncategorized
A bond wire has been evaporated by electrical overstress. Only visible by x-ray inspection! 
Apr 28, 2016 | Uncategorized
SMT-components which have to be soldered by wave soldering process before soldering have to be glued to the printed circuit board. The most economical technique is printing with a stainless steel stencil. For this process the same stencil printer can be used as for... 
Apr 27, 2016 | Uncategorized
For process qualification and inspection of covered solder joints high resolution x-ray inspection is an indispensable condition. 
Apr 27, 2016 | Uncategorized
JET-Printing or JET-Dispensing is a relatively new alternative methode for the application of solder paste. Advantages Stencil free paste printing Flexible application of solder paste amount Minimum setup times No costs for storage of stencils Minimum cleaning efforts... 
Apr 27, 2016 | Uncategorized
Paste printing is one of the most important factors for quality of solder joints and thus for the reliabiltiy of electronic assemblies. In the stencil printing process planar paste depots are generatet, with a hight which is mainly dependent on the stencil thickness. ... 
Apr 25, 2016 | Uncategorized
Wrong color images often improve the possibility to interpret difficult x-ray images.