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Stencil printing

27. April 2016

Paste printing is one of the most important factors for quality of solder joints and thus for the reliabiltiy of electronic assemblies. In the stencil printing process planar paste depots are generatet, with a hight which is mainly dependent on the stencil thickness.  Starting from design date the stencil apertures are modified for optimized paste volume. This to a certain amount allows to compensate disadvantages in the dimensioning of land sizes.

The latest X-ray technology in use at TAUBE ELECTRONIC

A completely new order of magnitude in quality assurance has been achieved by installing the Quadra 7 X-ray unit from Nordson Dage. At TAUBE ELECTRONIC X-ray technology...

Successful first year with the two new JUKI SMD placement modules RS-1R

TAUBE ELECTRONIC has been successfully using two new JUKI RS-1R placement machines in production since November 2020. After dismantling the old machines and installing...

Successful recertification audit according to DIN EN ISO 9001:2015-11

This year, the ISO 9001:2015 audit took place under special conditions. Due to the current pandemic situation, the entire recertification audit had to be carried out...

01005 components with distance of 60µm to Tantal-A capacitors

In the course of tighter and tighter layouts, this project was intended to test the limits of what is currently feasible with regard to different component sizes in one...

Expansion of the management board at TAUBE ELECTRONIC

Last December Dr. Lothar Weitzel joined TAUBE ELECTRONIC GmbH as Managing Director. The company was already well-known to him, as he had previously worked with Rainer...

300µm

TAUBE ELECTRONIC successfully enters 300µm pitch component class TAUBE ELECTRONIC since many years is one of the pioneers in processing components with very fine pitch....

X-ray Fluorescence-Spectroscopy

TAUBE ELECTRONIC starts to operate new Fischerscope X-Ray XDV-SSD Since the implementation of leadfree RoHS compliant assembly processes Micro X-ray fluorescence...

Glued Printed Circuit Board

Printed circuit board with stencil printed SMT adhesive in conveyor system of the pick and place machine.

Wetting failure on NiAu-Metallization

Wetting failures on NiAu-surfaces may have different root causes.

Fiducials

Fiducials according to SMEMA-standard have to be provided on all printed circuit boards, which have to be processed automated. The current revision of SMEMA-standard of...

Hidden solder joints

Even with hidden solder joints on conventional leaded components it is required to x-ray for process qualification and testing. By analysis of PCBAs, which were...

Conterfeit components

Components that have been bought from brokers after agreement of customers have to be carefully and in an extended procedure inspected at incoming goods inspection.

Component Failure

A bond wire has been evaporated by electrical overstress. Only visible by x-ray inspection!

Adhesive stencil printing

SMT-components which have to be soldered by wave soldering process before soldering have to be glued to the printed circuit board. The most economical technique is...

X-ray inspection with GE microme|x

For process qualification and inspection of covered solder joints high resolution x-ray inspection is an indispensable condition.

JET-Printing or JET-Dispensing

JET-Printing or JET-Dispensing is a relatively new alternative methode for the application of solder paste. Advantages Stencil free paste printing Flexible application...

X-Ray Image of Tantalum Capacitor

Wrong color images often improve the possibility to interpret difficult x-ray images.

Limited Reliability of Solder Joint with Vias in Pads

Vias in pads are a big reliability risk for solder joints, if components are reflow soldered. Often the solder is sucked from the pad through the via, causing a solder...