PCB Design

Design of complex impedance-controlled multilayers in HDI and rigid-flex technology

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Manufacturing

Contract manufacturing of high reliability electronic assemblies according to IPC-A-610 Class 2 and 3

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Rework

Rework of complex assemblies and BGA reballing of high pin count BGA packages with more than 1,500 solderballs

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Counseling

Counseling and testing …

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