Stencil printing

Paste printing is one of the most important factors for quality of solder joints and thus for the reliabiltiy of electronic assemblies. In the stencil printing process planar paste depots are generatet, with a hight which is mainly dependent on the stencil thickness.  Starting from design date the stencil apertures are modified for optimized paste volume. This to a certain amount allows to compensate disadvantages in the dimensioning of land sizes.