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300µm

15. February 2017

TAUBE ELECTRONIC successfully enters 300µm pitch component class

TAUBE ELECTRONIC since many years is one of the pioneers in processing components with very fine pitch. Therefore since some years successfully and reliable components of size 0201 and µBGAs with pitch of 400µm are mounted and soldered.

For extremely dense applications there are components in the market since some time with even smaller pitch. In the class of chip components this is mainly package size 01005, in the class of higher integrated circuits there are micro BGAs with a pitch of 300µm. These components increase the requirements in all steps of the manufacturing process dramatically, especially for paste printing.

TAUBE ELECTRONIC has already in 2015 qualified processing of chip components type 01005 by comprehensive tests. When we got a call for help of a new customer who was in trouble with these components we were happy to prove our knowledge with this high-tech application on a very small and thin circuit board.

By extensive risk analysis we could assure that already in the first approach we achieved a high yield that could be shipped to our customer according to his also very challenging time frame.

Successful recertification audit according to DIN EN ISO 9001:2015-11

This year, the ISO 9001:2015 audit took place under special conditions. Due to the current pandemic situation, the entire recertification audit had to be carried out...

01005 components with distance of 60µm to Tantal-A capacitors

In the course of tighter and tighter layouts, this project was intended to test the limits of what is currently feasible with regard to different component sizes in one...

Expansion of the management board at TAUBE ELECTRONIC

Last December Dr. Lothar Weitzel joined TAUBE ELECTRONIC GmbH as Managing Director. The company was already well-known to him, as he had previously worked with Rainer...

IPC-A-610 Training Course for Specialists and Trainer 2017

The standard IPC-A-610 (Acceptability of Electronic Assemblies) is the accepted base for the international electronics industry for visual inspection of printed circuit...

X-ray Fluorescence-Spectroscopy

TAUBE ELECTRONIC starts to operate new Fischerscope X-Ray XDV-SSD Since the implementation of leadfree RoHS compliant assembly processes Micro X-ray fluorescence...

Glued Printed Circuit Board

Printed circuit board with stencil printed SMT adhesive in conveyor system of the pick and place machine.

Wetting failure on NiAu-Metallization

Wetting failures on NiAu-surfaces may have different root causes.

Fiducials

Fiducials according to SMEMA-standard have to be provided on all printed circuit boards, which have to be processed automated. The current revision of SMEMA-standard of...

Hidden solder joints

Even with hidden solder joints on conventional leaded components it is required to x-ray for process qualification and testing. By analysys of PCBAs, which were...

Conterfeit components

Components that have been bought from brokers after agreement of customers have to be carefully and in an extended procedure inspected at incoming goods inspection.

Component Failure

A bond wire has been evaporated by electrical overstress. Only visible by x-ray inspection!

Adhesive stencil printing

SMT-components which have to be soldered by wave soldering process before soldering have to be glued to the printed circuit board. The most economical technique is...

X-ray inspection with GE microme|x

For process qualification and inspection of covered solder joints high resolution x-ray inspection is an indispensable condition.

JET-Printing or JET-Dispensing

JET-Printing or JET-Dispensing is a relatively new alternative methode for the application of solder paste. Advantages Stencil free paste printing Flexible application...

Stencil printing

Paste printing is one of the most important factors for quality of solder joints and thus for the reliabiltiy of electronic assemblies. In the stencil printing process...

X-Ray Image of Tantalum Capacitor

Wrong color images often improve the possibility to interpret difficult x-ray images.

Limited Reliability of Solder Joint with Vias in Pads

Vias in pads are a big reliability risk for solder joints, if components are reflow soldered. Often the solder is sucked from the pad through the via, causing a solder...

IPC Apex Expo – Las Vegas

13.03.-17.03.2016 Die IPC Apex Expo findet vom 13. März bis 17. März 2016 im Convention Center, in Las Vegas statt.  Taube Electronic GmbH ist vor Ort. Für weitere...